Elastic bladder method of fabricating an integrated circuit pack

Details Elastic bladder method of fabricating an integrated circuit pack Elastic bladder method of fabricating an integrated circuit pack

1986-01-21

1987-01-13

Dawson, Robert A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

100 93P, 100211, 156323, 1565833, B32B 3120

Patent

active

046362754

ABSTRACT:
An integrated circuit package is fabricated by assembling a stack which is comprised of a plurality of thin flat epoxy-glass layers, adhesive layers between the epoxy-glass layers, and a staircase-shaped cavity. This cavity extends from an outer epoxy-glass layer to an internal epoxy-glass layer, goes parallel along a portion of the flat surface of the internal epoxy-glass layer, and then penetrates through it. Conductors lie on the internal epoxy-glass layer including bonding pads on the flat surface portion. After the stack is assembled, the outer epoxy-glass layer and the cavity are covered with an elastic bladder. Subsequently, the stack is laminated by forcing a fluid into the bladder at a temperature and pressure which causes the bladder's membrane to stretch and push against all the surfaces of the cavity. This dams the adhesive from flowing onto the bonding pads.

REFERENCES:
patent: 2646105 (1953-07-01), Langer
patent: 3964958 (1976-06-01), Johnston
patent: 3967996 (1976-07-01), Kamov et al.
patent: 4273604 (1981-06-01), Johnston
patent: 4437921 (1984-03-01), Bichet
patent: 4450029 (1984-05-01), Holbert et al.

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