Ejector controlled soldering device

Details Ejector controlled soldering device Ejector controlled soldering device

1978-05-03

1979-07-24

Husar, Francis S.

Metal fusion bonding

Including means to apply flux or filler to work or applicator

By partial or total immersion of work or applicator into liquid

228 20, 118429, B23K 306

Patent

active

041620348

ABSTRACT:
Solder is forced through an ejector and flow well to impinge a solder fountain against soldered leads extending through a circuit board from a component. The solder on the leads is melted to permit the removal and replacement of the component. Overflowing solder is collected and recirculated by action of the ejector. The construction of the solder fountain is such that there are no close fitting moving parts which may become clogged by solder inclusions.

REFERENCES:
patent: 1272358 (1918-07-01), Bell
patent: 2387736 (1945-10-01), Bierman
patent: 2993272 (1961-07-01), Carlzen et al.
patent: 3277566 (1966-10-01), Christensen
patent: 3684151 (1972-08-01), Burman et al.
patent: 3765591 (1973-10-01), Cook
patent: 3874068 (1975-04-01), Cook
Advertiser's Brochure (undated) -- Air-Vac Engineering Co. Inc. "Module Components" Sheet RS-14 (Model PCBRM-6).
"A Short Course on Transvector.TM. Air Flow Amplifier with Application Notes" Vortex Corporation (undated) pp. 1-3.

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