Ejection of superplastically formed part with minimum distortion

Details Ejection of superplastically formed part with minimum distortion Ejection of superplastically formed part with minimum distortion

1986-04-25

1988-05-03

Larson, Lowell A.

Metal deforming

With means to handle work or product

Including product handling means

72344, 249 67, 249 74, B21D 4502

Patent

active

047411970

ABSTRACT:
A method of removing or ejecting a part from a first die after the part has been superplastically formed in a cavity of the die at an elevated temperature such that the part sticks to the surfaces of the die. The method includes the steps of forming a flange of the part between opposed die surfaces and providing movable plate within the die cavity and a ring on the opposed surface of the first die that engages the flange and the part in the cavity in a uniform manner. The movable plate and ring are then translated away from the die surfaces to uniformly move the part from the first die after the dies are separated.

REFERENCES:
patent: 1318404 (1919-10-01), Penn
patent: 1690523 (1928-11-01), Bell
patent: 2272718 (1942-02-01), MacLagan et al.
patent: 2302367 (1942-11-01), Ericson
patent: 2583441 (1952-01-01), Palmer
patent: 3477095 (1969-11-01), Lensky
patent: 3802245 (1974-04-01), Garner et al.
patent: 3867830 (1975-02-01), Dittwiler
patent: 3893644 (1975-07-01), Drazick
patent: 3942755 (1976-03-01), Robinson
patent: 4354369 (1982-10-01), Hamilton
patent: 4474044 (1984-10-01), Leistner et al.
patent: 4502309 (1985-03-01), Hamilton et al.

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