Efficiently cool data centers and electronic enclosures...

Details Efficiently cool data centers and electronic enclosures... Efficiently cool data centers and electronic enclosures...

2011-06-07

2011-06-07

Gandhi, Jayprakash N (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S679480, C361S679540, C361S694000, C361S695000, C361S697000, C361S700000, C361S702000, C361S704000, C361S719000, C165S080200, C165S185000

Reexamination Certificate

active

07957132

ABSTRACT:
Disclosed in the present invention are methods for cooling components contained in enclosures that reject 500 or more Watts employing two phase passive heat transfer devices including Loop Heat Pipes and devices we refer to as LHPLs. The methods minimize the amount of energy employed in cooling while at the same time maximizing the quality of heat rejected to the secondary cooling loops that transmit the heat to the outside world. Where data centers provide direct access to chilled water it becomes possible to reject heat directly to cooling towers in locations as hot and humid as Atlanta Ga. eliminating 40% or more of the total energy consumed. The key advances that make this energy efficient performance possible employ LHPLs that have the smallest possible total thermal resistance, methods that maximize their effectiveness and ancillary devices that minimize the energy consumed in cooling with air.

REFERENCES:
patent: 5203399 (1993-04-01), Koizumi
patent: 5998863 (1999-12-01), Kobayashi et al.
patent: 6643132 (2003-11-01), Faneuf et al.
patent: 6657121 (2003-12-01), Garner
patent: 6693797 (2004-02-01), Faneuf et al.
patent: 6789611 (2004-09-01), Li
patent: 6796372 (2004-09-01), Bear
patent: 6829142 (2004-12-01), Belady et al.
patent: 6840304 (2005-01-01), Kobayashi et al.
patent: 6967841 (2005-11-01), Chu et al.
patent: 6972365 (2005-12-01), Garner
patent: 6981543 (2006-01-01), Chesser et al.
patent: 7068509 (2006-06-01), Bash et al.
patent: 7071408 (2006-07-01), Garner
patent: 7133283 (2006-11-01), Faneuf et al.
patent: 7203063 (2007-04-01), Bash et al.
patent: 7233491 (2007-06-01), Faneuf et al.
patent: 7380585 (2008-06-01), Liu et al.
patent: 7403384 (2008-07-01), Pflueger
patent: 7539020 (2009-05-01), Chow et al.
patent: 7599184 (2009-10-01), Upadhya et al.
patent: 7650932 (2010-01-01), Li
patent: 7654310 (2010-02-01), Li
patent: 2006/0113066 (2006-06-01), Mongia et al.
patent: 102008020038 (2009-11-01), None
patent: 59029992 (1984-02-01), None

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