Efficient solid-state high frequency power amplifier structure

Details Efficient solid-state high frequency power amplifier structure Efficient solid-state high frequency power amplifier structure

1998-10-19

2000-12-12

Pascal, Robert

Amplifiers

With semiconductor amplifying device

Including plural amplifier channels

330307, 333137, H03F 368, H03F 314, H01P 512

Patent

active

061604542

ABSTRACT:
A power amplifier uses a plurality of solid-state amplifiers (FIGS. 2 and 3, 140) arranged in a parallel manner to form a power amplifier module (10). Each solid-state amplifier is adhered to a low thermal expansion insert (130). The insert is then coupled to a low cost aluminum substrate in order to carry the excess heat from each solid-state amplifier (140) to the aluminum housing. The power outputs from the solid-state amplifiers from each module are combined with the power outputs from other modules using electroformed waveguide combiners (FIG. 1, 30, 40).

REFERENCES:
patent: 4291278 (1981-09-01), Quine
patent: 4647869 (1987-03-01), Kaneko et al.
patent: 4677393 (1987-06-01), Sharma
patent: 5329248 (1994-07-01), Izadian
patent: 5497050 (1996-03-01), Cheo
patent: 5561397 (1996-10-01), Kumar et al.
patent: 5838201 (1998-11-01), Sechi

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