Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With mating connector which receives panel circuit edge
Reexamination Certificate
2007-05-22
2009-06-16
Paumen, Gary F. (Department: 2833)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With mating connector which receives panel circuit edge
Reexamination Certificate
active
07547214
ABSTRACT:
A connector apparatus for connecting at least two electronic component substrates, e.g., printed circuit boards or flex circuits, to one another at the edges thereof, wherein each of the at least two substrates further comprises at least one electrically conductive contact surface, and wherein the connector apparatus further includes: at least one electrically conductive transverse conducting member, wherein a first portion of the at least one transverse conducting member physically touches the contact surface on the first substrate, and wherein a second portion of the transverse conducting member physically touches the contact surface on the second substrate; and mechanical means for securing the at least one transverse conducting member to each of the substrates and to each of the contact surfaces.
REFERENCES:
patent: 5788510 (1998-08-01), Walker
patent: 6147871 (2000-11-01), DeWitt et al.
patent: 6253266 (2001-06-01), Ohanian
patent: 6976848 (2005-12-01), Choi
patent: 7044745 (2006-05-01), Reinhardt et al.
patent: 7045891 (2006-05-01), Choi
Daily Christopher G.
Duesterhoeft Scott S.
Mostoller Matthew E.
Weber Ronald M.
Paumen Gary F.
Tyco Electronics Corporation
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