Edge-sealed substrates and methods for effecting the same

Details Edge-sealed substrates and methods for effecting the same Edge-sealed substrates and methods for effecting the same

2005-10-04

2005-10-04

Lebentritt, Michael (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Encapsulating

C438S106000

Reexamination Certificate

active

06951778

ABSTRACT:
Methods and systems of protecting substrates that are intended for use in fluidic devices are described. In accordance with one embodiment, sealant material is applied over one or more edges of at least one multi-chip module substrate that is intended for use in a fluidic device. At least one edge has an exposed electrical interconnect and the sealant material is applied over less than an entirety of the substrate and sufficiently to cover the exposed electrical interconnect. The sealant material is exposed to conditions effective to seal the one or more edges.

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