Edge seal with polysilicon in LOCOS process

Details Edge seal with polysilicon in LOCOS process Edge seal with polysilicon in LOCOS process

1982-11-15

1984-03-06

Smith, John D.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

156643, 156657, 156662, 427 94, H01L 2176

Patent

active

044354460

ABSTRACT:
Intrinsic polysilicon is used to seal the sidewalls of the active areas formed in a silicon substrate in an integrated circuit with no additional masking required over a standard local oxidation (LOCOS) process. Since polysilicon and silicon are compatible materials, a "bird's beak" free structure is produced with a minimum number of defects during subsequent processing.

REFERENCES:
patent: 4292156 (1981-09-01), Matsumoto et al.
R. D. Isaac, "Fabrication Process for Full Box Isolation Without a Bird's Beak", IBM Tech. Disclosure Bulletin, vol. 22, No. 11 (Apr. 1980), pp. 5148-5151.

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