Edge rinse mechanism for removing a peripheral portion of a resi

Details Edge rinse mechanism for removing a peripheral portion of a resi Edge rinse mechanism for removing a peripheral portion of a resi

1998-01-09

1999-11-30

Utech, Benjamin

Coating apparatus

With vacuum or fluid pressure chamber

118 52, 118319, 118 56, 134153, 134157, B08B 504

Patent

active

059935472

ABSTRACT:
In a resist deposition machine, an edge rinse mechanism comprising a cover covering and surrounding an exfoliating-agent discharging nozzle and having an opening formed at a position in the proximity of a peripheral edge portion of a wafer held on a vacuum chuck, and a forced-exhausting tube coupled to the cover. In an edge rinsing operation, the peripheral edge portion of the wafer is accommodated through the opening into an inside of the cover, and a resist exfoliating agent is discharged from the exfoliating-agent discharging nozzle to a peripheral portion of a resist film formed on the wafer held on the vacuum chuck, so that a dissolved resist material and the resist exfoliating agent are scattered into the inside of the cover, and forcibly exhausted from the cover through the forced-exhausting tube. Thus, it is possible to prevent the dissolved resist material and the resist exfoliating agent from adhering on a resist pattern formation zone of the resist film formed on the wafer.

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patent: 5688322 (1997-11-01), Motoda et al.
patent: 5762708 (1998-06-01), Motoda et al.
patent: 5861061 (1999-01-01), Hayes et al.
patent: 5916631 (1999-06-01), Mahneke

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