Edge normal process

Details Edge normal process Edge normal process

2005-09-20

2005-09-20

Patel, Kanjishai (Department: 2625)

Image analysis

Applications

Manufacturing or product inspection

C438S014000

Reexamination Certificate

active

06947588

ABSTRACT:
An edge inspection method for detecting defects on a wafer edge normal surface includes acquiring a set of digital images which captures a circumference of the wafer. An edge of the wafer about the circumference is determined. Each digital image is segmented into a plurality of horizontal bands. Adjacent edge clusters about the circumference of the wafer are combined into edge pixel bins. The edge pixel bins are analyzed via edge clusters analysis to identify defects. The edge pixel bins are also analyzed via blob analysis to determine defects.

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