Edge-mounted, surface-mount package for semiconductor integrated

Details Edge-mounted, surface-mount package for semiconductor integrated Edge-mounted, surface-mount package for semiconductor integrated

1988-03-14

1990-12-04

James, Andrew J.

Electricity: electrical systems and devices

Safety and protection of systems and devices

With specific current responsive fault sensor

357 72, 361397, 361404, 361417, H05K 712, H01L 2350

Patent

active

049757636

ABSTRACT:
A flat package for semiconductor integrated circuit devices allows edge-mounting and surface-mount. The package may be molded plastic containing a semiconductor chip, and flat leads extend from one edge of the package. The leads are bent to provide an area to solder to conductors on a PC board. Mechanical positioning, mechanical support and spacing are provided by studs extending from the edge of the package adjacent the leads. The studs have stops formed at a position even with flat outer surfaces of the bent leads; the portion outward of the stops fits into holes in the PC board.

REFERENCES:
patent: 3546362 (1970-12-01), Berger
patent: 3604836 (1971-09-01), Pierpoint
patent: 3793720 (1974-02-01), Van Risewijk
patent: 4063791 (1977-12-01), Cutchaw
patent: 4246627 (1981-01-01), Poensgen
patent: 4293175 (1981-10-01), Cutchaw
patent: 4625260 (1986-11-01), Jordan et al.
patent: 4644096 (1987-02-01), Gutierrez et al.
patent: 4672421 (1987-06-01), Lin
patent: 4673967 (1987-06-01), Hingorany
patent: 4730238 (1988-03-01), Cook
patent: 4750092 (1988-06-01), Werther
patent: 4764846 (1988-08-01), Go
patent: 4768961 (1988-09-01), Lau
Lahiri, "Method for Formation and Attachment of Pins to a Silicon Wafer", IBM TDB, vol. 22, No. 7, Dec. 79, pp. 2957-2958.

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