Edge-mounted, surface-mount integrated circuit device

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type

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Details

361764, H01L 2302

Patent

active

053528514

ABSTRACT:
An edge-mounted integrated circuit device (10 ) includes a semiconductor die (11) and a lead frame (15) attached to the semiconductor die (11). The lead frame (15) includes a plurality of leads (14) electrically connected to the semiconductor die and lead frame supports (16, 18). A package (12) encapsulates the semiconductor die and a portion of the lead frame (15). The leads (14) extend from the package (12) and are bent to present a face for surface mount connection to conductors on a substrate. The supports (16, 18) extend from the package (12) for contacting the substrate to support the device (10) in position for soldering the leads (14) to conductors on the substrate.

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