Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2011-08-23
2011-08-23
Parekh, Nitin (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S098000, C257S432000, C257S707000, C257S723000, C257SE23101
Reexamination Certificate
active
08004080
ABSTRACT:
A module has a substrate, first and second integrated circuits, and a heat sink. The integrated circuits each have a first major surface, a second major surface, a first edge, a second edge, and a third edge and have optical circuits having ports on the first edge and electronic circuits having ports on the second edge. The second edges are connected to the substrate. The first major surface of the second integrated circuit is parallel with the second major surface of the first integrated circuit. The heat sink has a backplane adjacent to the third edge, a first portion along the first major surface of the first integrated circuit, a second portion along the second major surface of the second integrated circuit extending from the backplane, and an insert between the first major surface of the second integrated circuit and the second major surface of the first integrated circuit.
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U.S. Appl. No. 12/105,456, filed Apr. 18, 2008.
McShane Michael B.
Pelley Perry H.
Chiu Joanna G.
Clingan, Jr. James L.
Freescale Smeiconductor, Inc.
Parekh Nitin
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