Edge gripping device for handling a set of semiconductor...

Cleaning and liquid contact with solids – Processes – Work handled in bulk or groups

Reexamination Certificate

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Details

C134S133000, C134S165000, C134S902000, C118S503000, C206S711000

Reexamination Certificate

active

06845779

ABSTRACT:
A microelectronic substrate handling device comprising first and second support structures spaced from each other, the first support structure having a series of upper teeth defining a series of upper notches extending along a length of the first support structure and a series of lower teeth defining a series of lower notches extending along a length of the first support structure, each of the upper and lower notches opening toward the second support structure, wherein the upper and lower notches are offset from each other by a predetermined offset distance so that an edge of a microelectronic device will fit differently within the upper and lower notches of the first support structure when supported between the first and second support structures.

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PCT International Search Report, PCT/US02/36168 (3 pages), Apr. 22, 2003.

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