Edge clip terminal for mounting thick film hybrid circuits in pr

Details Edge clip terminal for mounting thick film hybrid circuits in pr Edge clip terminal for mounting thick film hybrid circuits in pr

1979-01-02

1981-03-24

McGlynn, Joseph H.

Geometrical instruments

339275B, H01R 1312

Patent

active

042576687

ABSTRACT:
An improved edge clip terminal having a first diamond-shaped transition region connecting a plurality of tines, that clip over the edge of a substrate, to a first lead section and having a second diamond-shaped transition region connecting the first lead section to a second lead section. In an assembly, the second lead sections of a plurality of terminals are located in holes in a PC board with the second transition regions resting on the surface of the circuit board. The first lead sections are more narrow than the transition regions and of lengths that are sufficient for preventing solder wicking up them and into the areas of the tines during wave soldering of a circuit board so that a leaded substrate soldered into the circuit board may be tilted without damaging it. In an alternate embodiment of this invention, the lead portion of an edge clip terminal on a substrate has a pair of spaced apart transition regions in it. A first transition region and first length of lead space tines away from a second transition region in a hole in a circuit board for preventing solder wicking up the lead and tines during wave soldering so that the leaded substrate may be tilted without damaging it.

REFERENCES:
patent: 3864014 (1975-02-01), Lynch
patent: 4076356 (1978-02-01), Tamburro
patent: 4085998 (1978-04-01), Owens
IBM-Ecker et al., -Expandable Pin for C.B.-9-1970, p. 1016, vol. 13, No. 4.

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