Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1987-03-17
1988-04-19
Weidenfeld, Gil
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439876, H01R 402, H01R 909
Patent
active
047386274
ABSTRACT:
An edge clip for attachment to a contact pad on a substrate includes a pair of spaced-apart spring fingers, adapted to receive the edge of the substrate therebetween. One or both of the fingers may at least partially encircle and support a mass of solder. The fingers are joined to the body portion with a folded connecting portion integral with the body between its ends, and one or more folded end portions, aligned with the connecting portion, can be supported from carrier rails at one or both ends during manufacture.
REFERENCES:
patent: 2468368 (1949-04-01), Jackson
patent: 3764955 (1973-10-01), Ward
patent: 4120558 (1978-10-01), Seidler
patent: 4203648 (1980-05-01), Seidler
patent: 4367910 (1983-01-01), Seidler
North American Specialties Corporation
Paumen Gary F.
Weidenfeld Gil
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