ECP polymer additives and method for reducing overburden and...

Details ECP polymer additives and method for reducing overburden and... ECP polymer additives and method for reducing overburden and...

2007-02-27

2007-02-27

Wong, Edna (Department: 1753)

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Depositing predominantly single metal coating

C205S238000

Reexamination Certificate

active

10788571

ABSTRACT:
Electrochemical plating polymer additives and method which reduces metal overburden in an electroplated metal while optimizing gap fill capability are disclosed. The polymer additives are provided in an electrochemical plating bath solution and may include low cationic charge density co-polymers having aromatic and amine functional group monomers. The low cationic charge density polymers may include benzene or pyrollidone functional group monomers and imidazole or imidazole derivative functional group monomers.

REFERENCES:
patent: 4468291 (1984-08-01), Naarmann et al.
patent: 5527434 (1996-06-01), Hamnett et al.
patent: 60017092 (1985-01-01), None

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