Economical package with built-in end resistor used for semicondu

Details Economical package with built-in end resistor used for semicondu Economical package with built-in end resistor used for semicondu

1998-05-04

2000-11-21

Sough, Hyung Sub

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174255, 174261, 174264, 174 521, 257666, 257698, 257774, 361783, 361799, H05K 116, H01L 2302

Patent

active

06150615&

ABSTRACT:
A lead frame used for a semiconductor chip has built-in end resistors accurately patterned through lithographic techniques and an etching from a conductive bonding layer between an insulating film and a conductive metallic foil, the conductive metallic foil is patterned into a conductive island for a semiconductor chip and conductive strips for electric signals, and the built-in end resistors achieve impedance matching for the electric signals.

REFERENCES:
patent: 5122620 (1992-06-01), Neumann et al.
patent: 5866942 (1999-02-01), Suzuki et al.
patent: 5889325 (1999-03-01), Uchida et al.

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