Economical high density chip carrier

Details Economical high density chip carrier Economical high density chip carrier

2006-02-14

2006-02-14

Nguyen, Tuan H. (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S613000

Reexamination Certificate

active

06998290

ABSTRACT:
A method for forming a flip-chip joinable substrate having non-plated-on contact pads. The substrate has an external metal foil layer upon a dielectric layer upon a patterned internal metal layer having an internal contact area. An area of the external metal foil layer above the internal contact area is selected. A microvia cavity extending to the internal contact area is perforated centrally within the selected area and is filled with a mass of conductive paste forming an external contact pad. The external contact pad is used as an etch mask for removing the adjacent external metal foil.

REFERENCES:
patent: 5261593 (1993-11-01), Casson et al.
patent: 5372666 (1994-12-01), Kawasaki
patent: 5665650 (1997-09-01), Lauffer et al.
patent: 5706178 (1998-01-01), Barrow
patent: 5875102 (1999-02-01), Barrow
patent: 6010769 (2000-01-01), Sasaoka et al.
patent: 6046505 (2000-04-01), Howard
patent: 6072242 (2000-06-01), Son
patent: 6181569 (2001-01-01), Chakravorty
patent: 6329610 (2001-12-01), Takubo et al.
patent: 6507113 (2003-01-01), Fillion et al.
patent: 3161956 (1991-07-01), None
patent: 11330295 (1999-11-01), None
patent: WO 99/57762 (1999-11-01), None

Affiliated with

Also associated with

Rating

Economical high density chip carrier does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Economical high density chip carrier, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Economical high density chip carrier will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3696516