Easily repairable, low cost, high speed electromechanical assemb

Details Easily repairable, low cost, high speed electromechanical assemb Easily repairable, low cost, high speed electromechanical assemb

1984-04-02

1986-07-01

Davie, James

Electricity: electrical systems and devices

Safety and protection of systems and devices

With specific current responsive fault sensor

357 75, 361401, H01L 2340, H01L 2350

Patent

active

045983089

ABSTRACT:
An assembly of intercoupled integrated circuit die comprises: a substrate having a plurality of holes which extend through the substrate; each hole is of a size that is suitable to receive an integrated circuit die; a plurality of independent subassemblies are also provided; each subassembly includes an integrated circuit die and a heat sink which is attached to the back of the die and extends beyond it; each subassembly is aligned with a respective hole in the substrate such that the die lies in the hole and the heat sink extends beyond the hole and attaches to the substrate; subassemblies are interconnected by printed conductors on the substrate and discrete wires that are bonded from the front of the die to the conductors; and the die and heat sink have similar thermal expansion coefficients, while the substrate has a substantially different thermal expansion coefficient.

REFERENCES:
patent: 3786559 (1974-01-01), Smith
patent: 4413308 (1983-11-01), Brown
patent: 4484215 (1984-11-01), Pappas
Arnold et al., Two-Stage Module Seal, IBM Technical Disclosure Bulletin, vol. 21, No. 2 (7/1978).

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