Earphone assembly

Electrical audio signal processing systems and devices – Electro-acoustic audio transducer – Plural or compound reproducers

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C381S379000

Reexamination Certificate

active

07822220

ABSTRACT:
An earphone assembly (100) includes an insulative body (1), an audio plug (5) and an earphone (3). The insulative body (1) includes a main body (11), two side walls (12) located at two sides of the main body (11) and a connecting portion (13) connecting with the main body (11) and the two side walls (12). The main body (11), the side walls (12) and the connecting portion (13) together define a receiving space (10). The audio plug (5) is retained in the bottom of the connecting portion (13). The earphone (3) includes two headphones (31) and two rings (33) respectively connecting with the headphones (31) and the audio plug (5). The side walls (12) respectively form a pair of bulges (14) extending transversely and outwardly. The rings (33) include two resilient sections (331) respectively received in the bulges (14) and capable of elastically moving along the extending direction of the bulges (14) for changing the position of the headphones (31).

REFERENCES:
patent: 5706353 (1998-01-01), Arai et al.
patent: 6707924 (2004-03-01), Okiebisu
patent: 6914995 (2005-07-01), Kao

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Earphone assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Earphone assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Earphone assembly will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4209076

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.