Electrical audio signal processing systems and devices – Electro-acoustic audio transducer – Plural or compound reproducers
Reexamination Certificate
2006-09-12
2006-09-12
Le, Huyen (Department: 2615)
Electrical audio signal processing systems and devices
Electro-acoustic audio transducer
Plural or compound reproducers
C381S370000, C381S374000
Reexamination Certificate
active
07106877
ABSTRACT:
Earloops with improved post design for increased reliability and quality for over-the-ear style headsets are disclosed. The earloop includes an earloop main body having connecting and stabilizer portions and a post extending from the connection portion for insertion into a corresponding opening in an audio receiver/transmitter assembly. An embedded hardened steel member extends from the post into the connection portion. The stabilizer portion is configured to be positioned over, around and behind a user's ear. The earloop may be incorporated in a headset that includes the audio receiver/transmitter assembly that defines an opening to receive the post therethrough. The audio assembly may be positionable along a length of the post and rotatable about the post. The hardened steel member increases the stiffness and strength and minimizes breakage of the post and thus increases the reliability, quality, and useful life of the earloop and/or headset.
REFERENCES:
patent: 6449374 (2002-09-01), Skulley et al.
patent: 2004/0141628 (2004-07-01), Villaverde et al.
patent: 2004/0264720 (2004-12-01), Huang et al.
Kuo Jung-hua
Le Huyen
Plantronics Inc.
LandOfFree
Earloop for telecommunications headset does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Earloop for telecommunications headset, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Earloop for telecommunications headset will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3601064