Dynamic thermal management for integrated circuits

Details Dynamic thermal management for integrated circuits Dynamic thermal management for integrated circuits

2006-05-23

2006-05-23

Jones, Hugh (Department: 2128)

Data processing: structural design, modeling, simulation, and em

Simulating electronic device or electrical system

Computer or peripheral device

C700S293000, C713S322000, C713S323000

Reexamination Certificate

active

07050959

ABSTRACT:
The present invention provides for dynamic thermal management of integrated circuits, including memory modules, within a computer system. The thermal management methodology described herein closely couples software operation to hardware operation of the computer system, and allows each system to run at near optimum performance levels without exceeding specified maximum temperature thresholds. In order to achieve such results, the present invention relates physical characteristics of the integrated circuit with physical characteristics of the internal chassis environment, and translates this relationship into a maximum software performance setting. The system monitors and adjusts software performance such that the maximum performance setting is not exceeded.

REFERENCES:
patent: 5365487 (1994-11-01), Patel et al.
patent: 5798667 (1998-08-01), Herbert
patent: 5835885 (1998-11-01), Lin
patent: 5953685 (1999-09-01), Bogin et al.
patent: 5996084 (1999-11-01), Watts
patent: 6173217 (2001-01-01), Bogin et al.
patent: 6373768 (2002-04-01), Woo et al.
patent: 6393374 (2002-05-01), Rankin et al.
patent: 6470238 (2002-10-01), Nizar et al.
patent: 6535798 (2003-03-01), Bhatia et al.
patent: 0 855 653 (1998-07-01), None
patent: 0 921 458 (1999-06-01), None
patent: PCT/US2004/008893 (2004-03-01), None
Hafizi et al.: “Reliability of AlIn/As/GaInAs heterojunction bipolars transistors”; IEEE Trans. Elect. Dev.; pp. 2178-2185; 1993.

Affiliated with

Also associated with

Rating

Dynamic thermal management for integrated circuits does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Dynamic thermal management for integrated circuits, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Dynamic thermal management for integrated circuits will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3604517