Dynamic testing of electrical conductors

Thermal measuring and testing – Thermal testing of a nonthermal quantity – Of susceptibility to thermally induced deteriouration – flaw,...

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324 65R, 324158R, G01N 2714, G01R 2702

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active

RE0326259

ABSTRACT:
A technique is described that permits direct and accurate evaluation of a thin film conductor's reliability which requires only a few hours to carry out. The technique involves a temperature ramp procedure which dynamically exposes a conductor operating under constant current stress to a linear (in time) rise in temperature. Changes in resistivity of the conductor provides kinetic data that is directly related to both the electromigration process and the reliability of the device.

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patent: 3958176 (1976-05-01), Kraeutle
"Measurement of Thermal Diffusivity Using a Pyroelectric Detector", C. E. Yeack et al., J. Appl. Phys. 53 6, Jun. 1982, pp. 3947-3949.
"The Effect of Hydrogen Ambient on Electromigration in Al and Al-Cu Thin Films", George Sardo, Syracuse University, 1979.
"Circuit Board Testing", H. E. Meier IBM Tech. Disclosure Bulletin, vol. 23 No. 9, Feb. 1981, 324-73 PC.

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