Semiconductor device manufacturing: process – Miscellaneous
Reexamination Certificate
2007-05-29
2007-05-29
Dang, Phuc T. (Department: 2818)
Semiconductor device manufacturing: process
Miscellaneous
C438S778000
Reexamination Certificate
active
11027480
ABSTRACT:
A method for using ALD and RVD techniques in semiconductor manufacturing to produce a smooth nanolaminate dielectric film, in particular for filling structures with doped or undoped silica glass, uses dynamic process conditions. A dynamic process using variable substrate (e.g., wafer) temperature, reactor pressure and/or reactant partial pressure, as opposed to static process conditions through various cycles, can be used to minimize film roughness and improve gap fill performance and film properties via the elimination or reduction of seam occurrence. Overall film roughness can be reduced by operating the initial growth cycle under conditions which optimize film smoothness, and then switching to conditions that will enhance conformality, gap fill and film properties for the subsequent process cycles. Film deposition characteristics can be changed by modulating one or more of a number of process parameters including wafer temperature, reactor pressure, reactant partial pressure and combinations of these.
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Hausmann Dennis M.
Nie Bunsen
Papasouliotis George D.
Rulkens Ron
Tarafdar Raihan M.
Beyer & Weaver, LLP
Dang Phuc T.
Novellus Systems Inc.
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