Dynamic random access memory cell having an improved fin-structu

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor

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361303, 361329, 257303, 257307, 257308, H01G4/30

Patent

active

059034300

ABSTRACT:
The present invention provides a capacitor comprising: a semiconductor substrate; an inter-layer insulator formed over the silicon substrate; at least two interconnections formed within the inter-layer insulator, the two interconnections being distanced at a pitch in a lateral direction; a fin-structured storage electrode comprising a vertically extending column portion and a plurality of fins, each of which laterally and radially extends from the vertically extending column portion, the fins being spaced in a vertical direction and the vertically extending column portion extending through the inter-layer insulator to a surface of the semiconductor substrate and also extending upwardly from a surface of the inter-layer insulator, wherein the vertically extending column portion is smaller in diameter within the inter-layer insulator and larger in diameter over the inter-layer insulator; a capacitive insulation film formed on a surface of the fin-structured storage electrode; and an opposite electrode formed on the capacitive insulation film.

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patent: 5573967 (1996-11-01), Tseng
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patent: 5835337 (1998-11-01), Watanabe et al.
T. Ema et al., "3-Dimensional Stacked Capacitor Cell For 16M and 64M Drams", pp. 592-595, IEDM 88, IEEE 1988.

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