Dynamic metrology sampling techniques for identified lots,...

Data processing: generic control systems or specific application – Specific application – apparatus or process – Product assembly or manufacturing

Reexamination Certificate

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C700S108000

Reexamination Certificate

active

06947805

ABSTRACT:
Methods of using dynamic metrology sampling techniques for identified lots, and a system for performing such methods are disclosed. In one illustrative embodiment, the method comprises identifying at least one wafer to be processed, identifying a process tool in which at least one wafer is to be processed, obtaining enhanced metrology data regarding a process operation to be performed in the identified process tool prior to processing the identified at least one wafer in the identified process tool, and positioning at least one wafer in the identified process tool and performing the process operation thereon.

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“Cycle time advantages of mini batch manufacturing integrated metrology in a 300 mm vertical furnace”. Noben et al. Semiconductor Manufacturing Symposium, 2001 International. San Jose Ca. Oct. 8, 2001 - Oct. 10, 2001, pp. 411-414.

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