Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2005-07-19
2005-07-19
Vortman, Anatoly (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S719000, C361S710000, C257S713000, C257S717000, C165S080300
Reexamination Certificate
active
06920052
ABSTRACT:
The present invention relates to a method and apparatus that prevents/minimizes cracking in the ceramic body of processors. The ability to prevent/minimize cracking can ensure successful operation and substantially increase processor lifetime. The present invention discloses a device for maintaining a microprocessor in a desired relationship with a printed wiring board while limiting the transmission of shock and vibrational motion to and from the processor includes a printed wiring board, a processor, and a dynamic isolating mount compressed between the printed wiring board and the processor, wherein the processor maintains the dynamic isolating mount in a compressed state such that the dynamic isolating mount bears on the printed wiring board.
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Callahan Daniel L.
Iannuzzelli Raymond J.
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