Dynamic film thickness control system/method and its...

Details Dynamic film thickness control system/method and its... Dynamic film thickness control system/method and its...

2002-10-23

2008-10-14

Kackar, Ram N. (Department: 1792)

Coating apparatus

Gas or vapor deposition

Having means to expose a portion of a substrate to coating...

C118S721000, C118S726000, C118S712000, C204S192100, C204S298010

Reexamination Certificate

active

07435300

ABSTRACT:
A dynamic film thickness control system/method and its utilization consisting of a minimum of one mask plate arranged between a substrate and a vapor source. A film thickness control device is utilized for real-time control over deposited film thickness and gradually moves the mask plate according to the film thickness control value acquired by the film thickness control device, enabling the mask plate to mask film zones on the said substrate to achieve the film thickness of a design objective. When the required zones of deposition are masked, the deposition of a particular film layer is completed.

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