Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2005-05-24
2005-05-24
Corcoran, Gladys J P (Department: 1733)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S230000, C156S247000, C156S244110, C156S272600, C156S345420
Reexamination Certificate
active
06896754
ABSTRACT:
A dustfree filling and sealing apparatus is disclosed. A pair of wrapping clean films10which are free of cleaning are supplied from a pair of wrapping clean film supply means1. Two outer layer films10bare peeled off and removed from the wrapping clean films10by a pair of outer layer film peeling-off means2. Thus, clean surfaces of inner layer films10aappear. The two inner layer films10aare conveyed by a pair of inner layer film conveying means4so that these films are opposed. An object15is inserted between the inner layer films10aby an object filling means5. The inner layer films10aare sealed by an impulse seal head6. The present invention also discloses a wrapping clean film producing method and a dustfree container.
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Semiconductor International, p. 108, May 1991.
English Language Translation of p. 4, col. 1, Lines-8-18 of JP 62-909129.
Otsuka Koji
Yamaguchi Masahisa
Yamamoto Hiroshi
Corcoran Gladys J P
Dai Nippon Printing Co. Ltd.
Parkhurst & Wendel L.L.P.
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