Duplexer package

Details Duplexer package Duplexer package

1997-03-06

1999-01-12

Brown, Peter Toby

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

257724, 333132, 333193, H01L 2334

Patent

active

058594736

ABSTRACT:
A duplexer package comprises two surface acoustic wave filter chips having different band center frequencies and a phase matching circuit for matching the phases of the two SAW filter chips, the filter chips and the phase matching circuit being accommodated in one unit, wherein the phase matching circuit is formed in a layer providing a cavity for the filter chips, the layer defining the cavity being located above a face for mounting the surface acoustic wave filter chips. According to the present invention, the height of the duplexer package can be lowered.

REFERENCES:
patent: 5561406 (1996-10-01), Ikata et al.

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