Duplexer package

Details Duplexer package Duplexer package

1995-03-29

1996-10-01

Lee, Benny

Wave transmission lines and networks

Plural channel systems

Having branched circuits

333128, 333185, 333129, 333193, 333133, H01P 512

Patent

active

055614060

ABSTRACT:
A multilayer duplexer package is provided, which includes: two surface-acoustic-wave filter chips having different center pass band frequencies; and at least two phase matching circuits for matching the phase of one filter chip to that of the other filter chip, said phase matching circuits respectively comprising strip lines stacked one above another, and said strip lines each having a characteristic impedance higher than the characteristic impedance of an external circuit to be connected to the duplexer package.

REFERENCES:
patent: 5015973 (1991-05-01), Kawakami et al.
patent: 5103197 (1992-04-01), Turunen et al.
patent: 5323127 (1994-06-01), Komazaki et al.

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