Duplex feedthrough and method therefor

Details Duplex feedthrough and method therefor Duplex feedthrough and method therefor

1998-06-15

2000-08-29

Reichard, Dean A.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

174 65R, 174 5061, 174135, 29843, H01J 500

Patent

active

061111988

ABSTRACT:
A conductive feedthrough for providing electrical current to semiconductor packages. A conductive wall portion of a semiconductor package contains an insulating material disposed in an aperture in the conductive wall. The insulating material has an axial bore into which an electrical conductor is inserted. The conductor has a reduced diameter in the portion inside the axial bore and enlarged portions on either side of the axial bore.

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