Ductile electroless copper

Details Ductile electroless copper Ductile electroless copper

1985-10-25

1987-09-22

Kittle, John E.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

106 123, 427 541, B05D 100, B05D 306

Patent

active

046955054

ABSTRACT:
An electroless copper deposit having an elongation capability of at least 10 percent as determined by a mechanical bulge test on a foil having a thickness of between 1.5 and 2.0 mils.

REFERENCES:
patent: 4548644 (1985-10-01), Nakaso et al.
High Density Printed Wiring Boards by Additive Processes, May 22-25, 1984, Kamiyama et al, p. 5.
Microstructure and Ductility of Electroless Copper Deposits, Nakahara et al., 1983, Pergamon Press Ltd., p. 713.

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