Ductile copper

Details Ductile copper Ductile copper

1992-08-04

1993-10-26

Beck, Shrive

Coating processes

Measuring, testing, or indicating

427305, 427437, 4274431, C23C 2600

Patent

active

052564410

ABSTRACT:
An improved method of manufacturing electrolessly deposited copper is described. The copper deposits are useful in the manufacture of fully additive and partly additive plated-through hole, printed wiring boards. The copper is deposited from a bath containing a copper compound, a complexing agent for copper, a reducing agent for copper, a pH-adjusting agent and one or more addition agents. The improvement for producing highly stress resistant, copper deposits comprises controlling one or more plating bath parameters such as pH, complexing agents and sources of iron or chromium, so that the trace iron and/or chromium in the deposited copper is less than 2 mg/mole of copper.

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Standard Specification IPC-AM-372, "Electroless Copper Film for Additive Printed Boards," The Institute for Interconnecting and Packaging Electronic Circuits, Lincolnwood, Ill. (1978).
Japanese Industrial Standard JIS H 8646, "Electroless Copper Platings," Japanese Standards Association, Tokyo, Japan (1991).

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