Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1997-08-29
1999-08-31
Thompson, Gregory
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
16510421, 16510433, 174 152, 257715, 257722, H05K 720
Patent
active
059461900
ABSTRACT:
A low-cost high aspect ratio skived heatsink with high performance ducting in order to optimize airflow over and through the skived fins. The skived heatsink can additionally have formed channels or extruded holes for insertion of a heatsink pipe therein. A thermally enhanced compound is used between the heatsink and heatpipe to provide a low thermal resistance between the parts. The heatpipe is expanded to optimally fill the channel or hole by injecting pressured fluid into the pipe before sealing the pipe with working fluid, or via heating of a sealed pipe and expansion of the working fluid therein. A partitioned cooling system can additionally be used, one partitioned section having high volume airflow with low static pressure, and another partitioned section using higher velocity ducted air over a plurality of skived heatsinks.
REFERENCES:
patent: 4120019 (1978-10-01), Arii et al.
patent: 4414604 (1983-11-01), Matsui et al.
patent: 5396403 (1995-03-01), Patel
patent: 5402160 (1995-03-01), Kadowaki et al.
patent: 5430611 (1995-07-01), Patel
patent: 5587882 (1996-12-01), Patel
patent: 5598320 (1997-01-01), Toedtman et al.
"Forced Air Cooling for High Power Pin Grid Array Packages in Confined Spacings," by S. L. Chao and E.D. Humm; published in Cooling Technology for Electronic Equipment, 1988, pp. 157-167; by Hemisphere Publishing Corporation.
Product Data Sheet by Showa Aluminum Corporation: Aluminum Heat Exchangers, Nov. 1988, printed in Japan.
Amerson Frederic
Belady Christian
Patel Chandrakant D.
Hewlett--Packard Company
Thompson Gregory
LandOfFree
Ducted high aspect ratio heatsink assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Ducted high aspect ratio heatsink assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Ducted high aspect ratio heatsink assembly will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2427842