Dual track stenciling system with solder gathering head

Details Dual track stenciling system with solder gathering head Dual track stenciling system with solder gathering head

1997-08-26

2000-05-23

Mayes, Curtis

Coating apparatus

Solid applicator contacting work

With work-handling or work-supporting

118301, 118406, 101123, 101127, 101129, 427 96, 427282, B05C 100, B05C 300, B05B 1504, B05D 512

Patent

active

060662069

ABSTRACT:
A dual track stencil system includes a first set of rails and a second set of rails, each of the rails being independently controlled for allowing for independent movement of circuit boards through the stencil system for processing. The stencil system includes a working area at which the circuit boards are stenciled and includes a stencil having two patterns formed thereon. In one embodiment, the stencil system includes a solder dispensing system for dispensing solder paste onto the stencil.

REFERENCES:
patent: 4622239 (1986-11-01), Schoenthaler et al.
patent: 4715278 (1987-12-01), Ericsson
patent: 4890241 (1989-12-01), Hoffman et al.
patent: 5044306 (1991-09-01), Erdmann
patent: 5151132 (1992-09-01), Zimmer
patent: 5309837 (1994-05-01), Nanzai
patent: 5483884 (1996-01-01), Vellanki
patent: 5873939 (1999-02-01), Doyle et al.

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