Dual substrate package assembly coupled to a conducting member

Details Dual substrate package assembly coupled to a conducting member Dual substrate package assembly coupled to a conducting member

1996-05-24

1999-09-14

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361784, 361785, 361790, 361791, 361803, 257686, 257697, 439591, 324755, H05K 114, H01R 2368

Patent

active

059532149

ABSTRACT:
An electronic package assembly for being electrically connected to a conducting member (e.g., a printed circuit board) wherein the assembly includes a pair of substrates. The first substrate includes opposing circuit patterns, those on one surface being of higher density and thus adapted for having high density electronic devices mounted thereon. This high density pattern is electrically coupled to the lesser density second pattern which is connected to contacts of a second substrate. These contacts are of the lesser density also, and extend through a dielectric member for being coupled to conductors (e.g., copper circuit pads) on the conducting member. Ready separability of various parts of the assembly is thus assured.

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