Optics: measuring and testing – Inspection of flaws or impurities – Surface condition
Reexamination Certificate
2007-11-13
2007-11-13
Nguyen, Sang H. (Department: 2886)
Optics: measuring and testing
Inspection of flaws or impurities
Surface condition
C356S237400, C356S237500, C356S394000, C382S145000
Reexamination Certificate
active
11430681
ABSTRACT:
A method and apparatus for inspecting patterned substrates, such as photomasks, for unwanted particles and features occurring on the transmissive as well as pattern defects. A transmissive substrate is illuminated by a laser through an optical system comprised of a laser scanning system, individual transmitted and reflected light collection optics and detectors collect and generate signals representative of the light transmitted and reflected by the substrate. The defect identification of the substrate is performed using transmitted and reflected light signals from a baseline comparison between two specimens, or one specimen and a database representation, to form a calibration pixelated training set including a non-defective region. This calibration pixilated training set is compared to a transmitted-reflected plot map of the subject specimen to assess surface quality.
REFERENCES:
patent: 3835332 (1974-09-01), Bridges
patent: 3851951 (1974-12-01), Eveleth
patent: 4247203 (1981-01-01), Levy
patent: 4559603 (1985-12-01), Yoshikawa
patent: 4579455 (1986-04-01), Levy
patent: 4623256 (1986-11-01), Ikenaga et al.
patent: 4633504 (1986-12-01), Wihl
patent: 4644172 (1987-02-01), Sandland
patent: 4805123 (1989-02-01), Specht
patent: 4926489 (1990-05-01), Danielson
patent: 5563702 (1996-10-01), Emery
patent: 5572598 (1996-11-01), Wihl
patent: 5767974 (1998-06-01), Higashiguchi et al.
patent: 5822055 (1998-10-01), Tsai et al.
patent: 5838433 (1998-11-01), Hagiwara
patent: 5850467 (1998-12-01), Matsui et al.
patent: 5986263 (1999-11-01), Hiroi et al.
patent: 5995219 (1999-11-01), Tabata
patent: 6052478 (2000-04-01), Wihl
patent: 6282309 (2001-08-01), Emery
patent: 6373054 (2002-04-01), Hiroi et al.
patent: 6466314 (2002-10-01), Lehman
patent: 6556291 (2003-04-01), Yonezawa
patent: 6636301 (2003-10-01), Kvame
patent: 6836560 (2004-12-01), Emery
patent: 6850321 (2005-02-01), Yu
Robert M. Haralick,et al., “Image Analysis Using Mathematical Morphology,” IEEE Transactions on Pattern Analysis and Machine Intelligence, vol. PAMI-9, No. 4, Jul. 1987, pp. 332-350.
Anil K. Jain, “Image Analysis and Computer Vision, Fundamentals of Digital Image Processing,” Chapter 9, (1989), pp. 384-389.
Masataka Shiba, et at., “Automatic Inspection of Contaminates on Reticles,” SPIE vol. 470 Optical Microlithography III, (1984), pp. 233-240.
James A. Freeman, et al., “Neural Networks Algorithms, Applications, and Programming Techniques, Backpropagation,” Chapter 3, (1992), pp. 89-125.
KLA-Tencor Technologies Corporation
Nguyen Sang H.
Smyrski Law Group, A P.C.
LandOfFree
Dual stage defect region identification and defect detection... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Dual stage defect region identification and defect detection..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Dual stage defect region identification and defect detection... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3808240