Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2000-04-03
2002-04-30
Thompson, Gregory (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C257S718000, C361S715000, C361S737000
Reexamination Certificate
active
06381136
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a spring clip that couples a thermal element to an integrated circuit or integrated circuit package.
2. Background Information
Integrated circuits are assembled into packages that are soldered to printed circuit boards. The integrated circuits generate heat which must be removed to insure that the junction temperatures of the circuits operate below threshold levels. The heat generated by each integrated circuit primarily flows through the package. The package is typically constructed from a dielectric material which has a relatively low coefficient of thermal conductivity. The low thermal coefficient increases the temperature drop across the package and the junction temperature of the circuit.
Some packages contain a metal lid that reduces the thermal impedance between the integrated circuit and the ambient. A heat sink may be coupled to the metal lid to further improve the thermal efficiency of the assembly.
The surface roughness and a lack of co-planarity between the metal lid and the heat sink may create air gaps within the metal lid/heat sink interface. The air gaps increase the thermal impedance between the metal lid and the heat sink. The increase in thermal impedance may raise the junction temperature of the integrated circuit.
Some assemblies utilize a fastener such as a clip or a screw that pulls the heat sink into the metal lid. The pull force of the fastener decreases the thermal impedance of the metal lid/heat sink interface. Variations in the height of the integrated circuit package due to manufacturing tolerances may change the pull force of the fastener. The tolerances may create an undesirable reduction in the pull force and an increase in the thermal impedance of the metal lid/heat sink interface. It would be desirable to provide a clamping fastener for an electronic assembly which accommodates tolerances in the assembly.
SUMMARY OF THE INVENTION
One embodiment of the present invention is an electronic cartridge that includes a spring clip which attaches a thermal element to an integrated circuit or an integrated circuit package. The integrated circuit/package is mounted to a substrate. The cartridge may have a pin that extends from the thermal element and through the substrate. The spring clip is attached to the pin of the thermal element.
REFERENCES:
patent: 3801874 (1974-04-01), Stefani
patent: 3895267 (1975-07-01), Gordon et al.
patent: 4110552 (1978-08-01), Lombardi
patent: 4266267 (1981-05-01), Ruegg
patent: 4521827 (1985-06-01), Jordan et al.
patent: 4602315 (1986-07-01), Breese
patent: 4652971 (1987-03-01), Peterson et al.
patent: 4717989 (1988-01-01), De Barros et al.
patent: 4910434 (1990-03-01), Doumani et al.
patent: 5006667 (1991-04-01), Lonka
patent: 5014160 (1991-05-01), McCoy, Jr.
patent: 5020866 (1991-06-01), McIlwraith
patent: 5043534 (1991-08-01), Mahulikar et al.
patent: 5168926 (1992-12-01), Watson et al.
patent: RE34393 (1993-09-01), McIlwraith
patent: 5250752 (1993-10-01), Cutright
patent: 5278351 (1994-01-01), Herrick
patent: 5289337 (1994-02-01), Aghazadeh et al.
patent: 5289347 (1994-02-01), McCarthy et al.
patent: 5294994 (1994-03-01), Robinson et al.
patent: 5303113 (1994-04-01), Goleman et al.
patent: 5309315 (1994-05-01), Naedel et al.
patent: 5323299 (1994-06-01), Weber
patent: 5333100 (1994-07-01), Anhalt et al.
patent: 5354951 (1994-10-01), Lange, Sr. et al.
patent: 5398822 (1995-03-01), McCarthy et al.
patent: 5422433 (1995-06-01), Rivera et al.
patent: 5430607 (1995-07-01), Smith
patent: 5473111 (1995-12-01), Hattori et al.
patent: 5477421 (1995-12-01), Bethurum
patent: 5483423 (1996-01-01), Lewis et al.
patent: 5550713 (1996-08-01), Pressler et al.
patent: 5617294 (1997-04-01), Watson et al.
patent: 5642263 (1997-06-01), Lauruhn
patent: 5659459 (1997-08-01), Wakabayashi et al.
patent: 5699229 (1997-12-01), Brownell
patent: 5726865 (1998-03-01), Webb et al.
patent: 5734555 (1998-03-01), McMahon
patent: 5748446 (1998-05-01), Feightner et al.
patent: 5784263 (1998-07-01), Nelson
patent: 5829601 (1998-11-01), Yurchenco et al.
patent: 5838542 (1998-11-01), Nelson et al.
patent: 5854738 (1998-12-01), Bowler
patent: 5856910 (1999-01-01), Yurchenco et al.
patent: 5883782 (1999-03-01), Thurston et al.
patent: 5883783 (1999-03-01), Turturro
patent: 5894408 (1999-04-01), Stark et al.
patent: 5895972 (1999-04-01), Paniccia
patent: 5898219 (1999-04-01), Barrow
patent: 5903436 (1999-05-01), Brownell et al.
patent: 5912802 (1999-06-01), Nelson
patent: 5933323 (1999-08-01), Bhatia et al.
patent: 5933324 (1999-08-01), Barrett
patent: 5936838 (1999-08-01), Lii et al.
patent: 5965937 (1999-10-01), Chiu et al.
patent: 5973399 (1999-10-01), Stark et al.
patent: 5990549 (1999-11-01), Chiu et al.
patent: 6008988 (1999-12-01), Palmer
patent: 6011696 (2000-01-01), Mahajan et al.
patent: 6025990 (2000-02-01), Daskalakis et al.
patent: 6028771 (2000-02-01), Wong et al.
patent: 6043983 (2000-03-01), Taylor et al.
patent: 6043984 (2000-03-01), Tseng
patent: 6046906 (2000-04-01), Tseng
patent: 6061240 (2000-05-01), Butterbaugh et al.
patent: 6068051 (2000-05-01), Wendt
Chung Yoke
Nelson Daryl J.
Rutigliano Michael
Stark Michael
Thurston Mark
Blakely , Sokoloff, Taylor & Zafman LLP
Intel Corporation
Thompson Gregory
LandOfFree
Dual spring clip attachment mechanism for controlled... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Dual spring clip attachment mechanism for controlled..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Dual spring clip attachment mechanism for controlled... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2931545