Dual source lithography for direct write application

Details Dual source lithography for direct write application Dual source lithography for direct write application

2006-04-04

2006-04-04

Fuller, Rodney (Department: 2851)

Photocopying

Projection printing and copying cameras

Methods

C355S046000, C355S053000

Reexamination Certificate

active

07023530

ABSTRACT:
A dual exposure source lithography system forms a first and a second portion of a pattern on a wafer. An optical lithography module forms the first portion of the pattern. A non-optical lithography module forms the second portion of the pattern using a non-optical lithography exposure source. The non-optical exposure source is an electron beam lithography source, an EUV source, an x-ray source, or another next generation lithography system exposure source. A mask design file is decomposed into separate design files reflecting critical and non-critical components of the pattern to be formed on the wafer.

REFERENCES:
patent: 6327556 (2001-12-01), Geiger et al.
patent: 2002/0112214 (2002-08-01), Keller et al.
patent: 2003/0145286 (2003-07-01), Pajak et al.
patent: 2003/0188268 (2003-10-01), Kanstadinidis et al.
patent: 2003/0229860 (2003-12-01), Li
patent: 2004/0015791 (2004-01-01), Smith et al.
patent: 2005/0044513 (2005-02-01), Robles

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