Dual source lithography for direct write application

Details Dual source lithography for direct write application Dual source lithography for direct write application

2005-05-17

2005-05-17

Fuller, Rodney (Department: 2851)

Photocopying

Projection printing and copying cameras

Plural

C355S067000, C355S070000, C355S077000

Reexamination Certificate

active

06894762

ABSTRACT:
A dual exposure source lithography system forms a first and a second portion of a pattern on a wafer. An optical lithography module forms the first portion of the pattern. A non-optical lithography module forms the second portion of the pattern using a non-optical lithography exposure source. The non-optical exposure source is an electron beam lithography source, an EUV source, an x-ray source, or another next generation lithography system exposure source. A mask design file is decomposed into separate design files reflecting critical and non-critical components of the pattern to be formed on the wafer.

REFERENCES:
patent: 20030218730 (2003-11-01), Murakami et al.

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