Metal fusion bonding – Process – Plural joints
Patent
1996-09-09
1998-09-08
Ryan, Patrick
Metal fusion bonding
Process
Plural joints
228187, 228226, 2282332, B23K 3102, B23K 3526
Patent
active
058033440
ABSTRACT:
A high temperature thick-film hybrid circuit is characterized by a surface-mount circuit component that is electrically interconnected with a conductor. The surface-mount circuit component of the thick-film hybrid circuit is bonded to the conductor with a soldering technique employing dual-solder layers. The dual-solder layers enable component attachment to the conductor at a temperature below the maximum processing temperature of the component, while forming a solder joint that exhibits suitable adhesion properties at temperatures in excess of 165.degree. C. The dual-solder layers can be chosen to inhibit tin diffusion from the solder, silver leaching from the conductor, and the formation of a brittle intermetallic at the solder-conductor interface.
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"Reflow Solder Joint With Extended Height," IBM Tech. Discl. Bull., vol. 28, No. 7, Dec. 1985, p. 2871.
Ellis Marion Edmond
Paszkiet Christine Ann
Rama Sarma Dwadasi Hare
Stankavich Anthony John
Delco Electronics Corp.
Knapp Jeffrey T.
Navarre Mark A.
Ryan Patrick
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