Dual sip package structures

Details Dual sip package structures Dual sip package structures

1990-02-06

1992-04-07

Hille, Rolf

357 70, 357 75, H01L 2328, H01L 2348

Patent

active

051032899

ABSTRACT:
A dual SIP package for encapsulating a plurality of semiconductor die includes a first group of elongated metal leads each having first and second end portions, and a first group of enlarged metal pads each attached to the first end portion of one of the leads of the first group, a second group of elongated metal leads each having first and second end portions, and a second group of enlarged metal pads each attached to the first end portion of one of the leads of the second group, each of the pads of the first group being parallel to and aligned with a corresponding pad of the second group to form a pair. The first end portion of each of the leads of the first group is parallel to and aligned with the first end portion of a lead of the second group. Each of the die is disposed between and connected to a pair of the pads. The bottom electrode of each die is attached to a pad of the first group, and the top electrode of each die is attached to a pad of the second group. Plastic encapsulation surrounds the die, the first group of pads, and the first end portion of each of the leads of the first and second groups. The second end portion of each lead of the first and second groups extends beyond the encapsulation.

REFERENCES:
patent: 4160308 (1979-07-01), Courtney et al.
patent: 4189085 (1980-02-01), Penrod
patent: 4197555 (1980-04-01), Uehara et al.
patent: 4214120 (1980-07-01), Jones, Jr. et al.
patent: 4288912 (1981-09-01), Wills et al.
patent: 4633582 (1987-01-01), Ching et al.
patent: 4675718 (1987-06-01), Tsubokura et al.
patent: 4739440 (1988-04-01), Fujiki et al.
patent: 4801561 (1989-01-01), Sankhagowit
patent: 4935803 (1990-06-01), Kalfas et al.

Affiliated with

Also associated with

Rating

Dual sip package structures does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Dual sip package structures, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Dual sip package structures will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1899259