Dual-sided substrate measurement apparatus and methods

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Reexamination Certificate

active

07902040

ABSTRACT:
An apparatus for measuring the relative positions of frontside and backside alignment marks located on opposite sides of a substrate is disclosed. The apparatus includes upper and lower optical systems that allow for simultaneous imaging of frontside and backside alignment marks. The frontside and backside alignment mark images are processed to determine the relative position of the marks, as a measurement of the alignment and/or overlay performance of the tool that formed the marks on the substrate.

REFERENCES:
patent: 5621813 (1997-04-01), Brown et al.
patent: 7528937 (2009-05-01), Crespin et al.
patent: 7562686 (2009-07-01), Best et al.
patent: 2002/0167649 (2002-11-01), Heinle
patent: 2006/0141743 (2006-06-01), Best et al.
patent: 2006/0172507 (2006-08-01), Best et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Dual-sided substrate measurement apparatus and methods does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Dual-sided substrate measurement apparatus and methods, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Dual-sided substrate measurement apparatus and methods will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2639288

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.