Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates
Reexamination Certificate
2011-03-08
2011-03-08
Garber, Charles D (Department: 2812)
Semiconductor device manufacturing: process
Bonding of plural semiconductor substrates
Reexamination Certificate
active
07902040
ABSTRACT:
An apparatus for measuring the relative positions of frontside and backside alignment marks located on opposite sides of a substrate is disclosed. The apparatus includes upper and lower optical systems that allow for simultaneous imaging of frontside and backside alignment marks. The frontside and backside alignment mark images are processed to determine the relative position of the marks, as a measurement of the alignment and/or overlay performance of the tool that formed the marks on the substrate.
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Crespin Albert J.
Ellis Ray
Jamello Joe
Kulas Scott
True Emily
Garber Charles D
Jones Allston L.
Peters Verny LLP
Stevenson Andre′ C
Ultratech, Inc.
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