Dual sided lithographic substrate imaging

Details Dual sided lithographic substrate imaging Dual sided lithographic substrate imaging

2006-11-07

2006-11-07

Fuller, Rodney (Department: 2851)

Photocopying

Projection printing and copying cameras

Illumination systems or details

C438S460000

Reexamination Certificate

active

07133117

ABSTRACT:
A device manufacturing method capable of imaging structures on both sides of a substrate, is presented herein. One embodiment of the present invention comprises a device manufacturing method that etches reversed alignment markers on a first side of a substrate to a depth of 10 μm, the substrate is flipped over, and bonded to a carrier wafer and then lapped or ground to a thickness of 10 μm to reveal the reversed alignment markers as normal alignment markers. The reversed alignment markers may comprise normal alignment patterns overlaid with mirror imaged alignment patterns.

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