Dual sided laminated semiconductor mounting

Details Dual sided laminated semiconductor mounting Dual sided laminated semiconductor mounting

1994-02-28

1995-10-31

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

165 802, 165 803, 165185, 174 163, 174252, 361720, H05K 720

Patent

active

054635306

ABSTRACT:
An apparatus for carrying semiconductor mounting devices in back-to-back arrangement is disclosed in which a central substantially planar thermally conductive support member is provided with recesses in its top and bottom surfaces of an interlocking congruent shape with the semiconductor devices to be received such that each semiconductor mounting device assembled therein is positively positioned and locked in place and fixed in a manner such that the semiconductor elements mounted on the layered or laminar elements connect directly to circuitry carried on the surfaces of the support member.

REFERENCES:
patent: 3120350 (1964-02-01), Muenz
patent: 4551787 (1985-11-01), Mittal et al.
patent: 4574879 (1986-03-01), Degree et al.
patent: 4810563 (1989-03-01), DeGree et al.
patent: 5045642 (1991-09-01), Ohta et al.

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