Dual side fabricated semiconductor wafer

Details Dual side fabricated semiconductor wafer Dual side fabricated semiconductor wafer

1998-04-14

2000-01-04

Bowers, Charles

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

Subsequent separation into plural bodies

438459, 438928, 156344, H01L 2130, H01L 2146

Patent

active

060109513

ABSTRACT:
A method is provided involving re-slicing a wafer after dual-side alignment and processing has been performed. This procedure provides twice as many processed electronic devices without increasing the number of loading, processing and unloading procedures performed or the total number of substrates used. Another method is provided for creating two processed chips by attaching two conventional substrates, processing IC's on each of the two exposed, polished sides and then detaching the substrates. This technique reduces the number of loading, processing and unloading procedures required to produce a given number of IC chips by half. An apparatus and further method provides two different subsystems of a single IC processed on opposite sides of the same chip. Such a device saves cost by using fewer substrates to make the same number of chips. Also, the method performs loading, processing and unloading procedures half as much to produce a given number of IC's. The apparatus is an integrated circuit chip comprising two subsystems, each processed on a different side of the same silicon substrate. Sizes of chips is thereby decreased due to the smaller width of the substrate that results after processing.

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