Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – Distinct contact secured to panel circuit
Reexamination Certificate
2007-12-25
2007-12-25
Paumen, Gary (Department: 2833)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
Distinct contact secured to panel circuit
C439S736000, C439S516000, C385S092000, C385S093000, C385S089000, C385S088000
Reexamination Certificate
active
11066079
ABSTRACT:
Exemplary embodiments of the present invention illustrate lead frame connectors for connecting optical sub-assemblies to printed circuit boards in optical transceiver modules. The lead frame connectors include a stamped and bent conductive lead structure that is encased in a plurality of insert injection molded plastic casings. The plastic casings provide electrical insulation for the conductors in the lead frame as well as mechanical support for the finished component. The lead frame connectors connect to the leads associated with the optical sub-assemblies and are surface mounted onto the printed circuit board to establish connectivity between the optical sub-assembly and the printed circuit board.
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U.S. Appl. No. 11/066,030, filed Feb. 25, 2005 entitled “Methods for Manufacturing Lead Frame Connectors for Optical Transceiver Modules.”
U.S. Appl. No. 11/066,056, filed Feb. 25, 2005 entitled “Methods for Manufacturing Optical Modules Using Lead Frame Connectors.”
Douma Darin James
Ice Donald A.
Finisar Corporation
Paumen Gary
Workman Nydegger
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