Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With mating connector which receives panel circuit edge
Patent
1986-12-19
1988-07-12
Abrams, Neil
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With mating connector which receives panel circuit edge
439328, H01R 2370
Patent
active
047566949
ABSTRACT:
A connector housing included multiple rows of contacts with the housing molded to provide an orientation to receive printed circuit board modules inserted therein at an angle of substantially less than 90 degrees relative to a common printed circuit board module mounting board. The rows of the housings have at each end board guide and support slots containing latches integrally therewith and a central structural web connecting said rows and guide ends, the such web providing structural support of said rows and at the same time, serving as a path of flow during the connector molding process.
REFERENCES:
patent: 2904768 (1959-09-01), Rasmussen
patent: 2931006 (1960-03-01), Klumpp, Jr.
patent: 3082397 (1963-03-01), Clarkson et al.
patent: 3567998 (1971-03-01), Ammerman
patent: 3601775 (1971-08-01), Longenecker et al.
patent: 3753211 (1973-08-01), Pauza et al.
patent: 4077694 (1978-03-01), Cobaugh et al.
patent: 4473263 (1984-09-01), Sunstein
patent: 4575172 (1986-03-01), Walse et al.
patent: 4577922 (1986-03-01), Stipanuk et al.
"Edge Connectors", Molex Catalog, pp. 1F-5F, published 9-1985.
Billman Timothy B.
Thrush Roger L.
Zutaut Donald J.
Abrams Neil
AMP Incorporated
Groen Eric J.
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